Gold Member Since 2015
Audited Supplier
Shenzhen City Jia Rifeng Tai Electronic Technology Co., Ltd.

Silicone Gap Pad, Thermal Silicone Pad, Thermal Conductive Silicone manufacturer / supplier in China, offering Cooling Thermal Conductive Heatsink Silicone Gap Pad for IC / GPU, High Voltage Insulation Heat Disspation Rubber Silicone Cloth, Ys-3172 Shore Platinum Extrusion Silicone Raw Material and so on.

(/ )

Supplier Homepage Product Thermal Silicone Series Thermal Silicone Sheet Cooling Thermal Conductive Heatsink Silicone Gap Pad for IC / GPU

Cooling Thermal Conductive Heatsink Silicone Gap Pad for IC / GPU

FOB Price: Get Latest Price
Min. Order: 100 Pieces
Payment Terms: L/C, T/T, Paypal, Money Gram, Western Union

Request a custom order and have something just for you!

Send Customized Request
Basic Info
  • Model NO.: PM460
  • Type: Insulation Sheet
  • Material: Rubber
  • Maximum Voltage: <10KV
  • Certification: UL, SGS
  • Thickness Tolerance(Mm): 0.05+-0.01
  • Specific Gravity: 2.05
  • Thermal Conductivity(W/M-K): 4.6
  • Application: Electronic Products
  • Chemistry: Organic Insulation
  • Thermal Rating: 200 200
  • Classification: Organic Insulating Material
  • Brand: Jrft
  • Thickness(Mm): 0.25--5.0
  • Hardness(Shore a): 50+-5
Product Description
Product Introduction
JRF-PM460 is based on the high thermal conductivity of silica, boron nitride and aluminum oxide powder mixed into, the product can meet the requirements of heat radiating occasions for high and stable insulation performance. The product has good thermal conductivity, at the same time, this product has the self adhesive ,application and operation is simple and convenient.

JRF-PM460 is use of soft silicone material thermal conductive, good insulation performance, soft and elastic characteristics, placed between the power heating device and heat dissipating structure, the power module generates heat effectively transmit to the radiating component.

Applications:
1. Car engine module and vehicle electronic equipment
2. Notebook computer, table computer CPU
3. Flat panel TV, mobile equipment, high-speed hard disk driver
4. Semiconductor and the radiating fin between
5. Computer, PC server, workstation
6. LED lighting device and mass storage device


Performance and characteristics:

1.High thermal conductivity, heat transfer coefficient 4.6W/m-k
2.Stable performance , low thermal resistance, effectively improve the heat transfer speed
3.Low hardness , its viscosity high, easy to use adhesive
4.By UL and V-O certification standards 

Specification:
Standard size 310mm*310mm, 200mm*400mm according to customer needs cutting type
Basic thickness 0.25mm*5.0mm, special size and thickness can be customized
Itself is slightly viscous, if need to strengthen the adhesive can be according to customer' requirement.
Product color is mass production, if need special color can be adjusted according to the actual situation .
Cooling Thermal Conductive Heatsink Silicone Gap Pad for IC / GPU
Cooling Thermal Conductive Heatsink Silicone Gap Pad for IC / GPU


Cooling Thermal Conductive Heatsink Silicone Gap Pad for IC / GPU
Send your message to this supplier
Avatar
Miss Besy Wu
Sales
*From:
To: Miss Besy Wu
*Message:

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now

Find Similar Products By Category