Gold Member Since 2015
Audited Supplier
Shenzhen City Jia Rifeng Tai Electronic Technology Co., Ltd.

Aluminum Nitride Ceramic Substrate, Aluminum Nitride Thermal Substrate, Aluminum Nitride Insulation Substrate manufacturer / supplier in China, offering High Thermal Conductivity Aluminum Nitride ceramic Insulation Substrate, High Voltage Insulation Heat Disspation Rubber Silicone Cloth, Ys-3172 Shore Platinum Extrusion Silicone Raw Material and so on.

(/ )

Supplier Homepage Product Thermal Ceramic Series 95% Al2O3 Ceramic High Thermal Conductivity Aluminum Nitride ceramic Insulation Substrate

High Thermal Conductivity Aluminum Nitride ceramic Insulation Substrate

FOB Price: US $6.5 / Piece
Min. Order: 50 Pieces
Min. Order FOB Price
50 Pieces US $6.5/ Piece
Get Latest Price
Port: Shenzhen, China
Production Capacity: 5000000piece/Month
Payment Terms: T/T, Western Union, Paypal, Money Gram

Request a custom order and have something just for you!

Send Customized Request
Basic Info
  • Model NO.: TC-027
  • Type: Insulation Sheet
  • Material: Ceramic
  • Maximum Voltage: 20KV~100KV
  • Certification: UL, ISO9001, SGS
  • Brand: Jrft
  • Specific Gravity: >=3.6g/cm3
  • Thermal Conductivity: 180~230W/M.K
  • Shape: Sheet Type
  • Name: Aluminum Nitride Ceramic Substrate
  • Transport Package: Carton, OPP Bag
  • Origin: Shen Zhen
  • Application: Insulators, Electrical Winding Insulation, Winding Wire Coating Insulation, Electrical Base, Shell, Motor, Insulating Varnish, Switch Baseplate
  • Chemistry: Organic Insulation
  • Thermal Rating: 250 250
  • Classification: Organic Insulating Material
  • Color: Brown
  • Breakdown Voltage Strength: 15kv/mm
  • Hardness: >=88hra
  • Usage: High Power Devices
  • Sinterling Temp: 1780-1880 Degree
  • Trademark: JRFT
  • Specification: 110x110x110mm
  • HS Code: 193915
Product Description
high thermal conductivity aluminum nitride cermaic insulation substrate

product Introduction
Aluminum nitride ceramic thermal plate, high thermal conductivity, low coefficient of expansion, high 
strength, high temperature resistance, chemical resistance, high resistivity , low dielectric loss, is 
the ideal LSI heat dissipation board and packaging materials. 
Aluminum nitride ceramic plate use heat resistant melt erosion and thermal shock resistance, 
can produce GaAs crystal crucible, Al evaporation pan, MHD power generation equipment and high 
temperature turbine corrosion resistant parts, using its optical properties can be used as an infrared 
window
   
Aluminum Nitride Applications
1. Heat sinks & heat spreaders
2. Electrical insulators for lasers
3. Chucks, clamp rings for semiconductor processing equipment
4. Electrical insulators
5. Silicon wafer handling and processing
6. Substrates & insulators for microelectronic devices & opto electronic devices
7. Substrates for electronic packages
8. Chip carriers for sensors and detectors
9. Chiplets
10. Collets
11. Laser heat management components
12. Molten metal fixtures
13. Packages for microwave devices

Feature:
1.High hardness , diversity                       
2.High precision and density 
3.High reliability and stability                     
4.High thermal conductivity
5.Extremely abrasive resistance performance    
6.Wide scope of application 
  
Product  specifications:
Regular size and models :
0.38mm*114mm*114mm 
0.38mm*120mm*120mm
0.5mm*114mm*114mm
0.5mm*120mm*120mm
0.635mm*17mm*12mm
1.0mm*17mm*22mm
1.0mm*140mm*140mm
3.0mm*114mm*114mm

special size could be customized.
Send your message to this supplier
Avatar
Mr. Neil
Sales
*From:
To: Mr. Neil
*Message:

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now

Find Similar Products By Category