Gold Member Since 2015
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Shenzhen City Jia Rifeng Tai Electronic Technology Co., Ltd.

Thermal Paste, Gap Filling Silicone Paste, Thermal Conductive Paste manufacturer / supplier in China, offering Thermal Paste Heatsink Gap Filling Silicone Paste for LED, High Voltage Aln Ceramic Radiating Plate Alumina Nitride, Thermally Conductive-Natural Graphite Sheet and so on.

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Supplier Homepage Product Silicone Encapsulant Series Thermal Grease Thermal Paste Heatsink Gap Filling Silicone Paste for LED

Thermal Paste Heatsink Gap Filling Silicone Paste for LED

Purchase Qty.:
(kg)
20-99 100+
FOB Unit Price: US $18 US $12
Purchase Qty. (kg) FOB Unit Price
20-99 US $18
100+ US $12
Get Latest Price
Production Capacity: 100000 Kg / Month
Transport Package: Standard Export Packing
Payment Terms: L/C, T/T, Paypal, Money Gram, Western Union

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Basic Info
  • Model NO.: GM100
  • Type: Solid
  • Material: Silicone
  • Maximum Voltage: >10 Kv
  • Certification: UL
  • Brand: Jrft
  • Thermal Conductivity: 3.0 W/M.K
  • Oil Yield: <10 %
  • Trademark: OEM, ODM
  • Origin: Shenzhen China
  • Application: CPU/ Heat Sink / LED
  • Chemistry: Organic Insulation
  • Thermal Rating: 220 220
  • Classification: Organic Insulating Material
  • Color: Hoar
  • Density: 2.55G/M3
  • Dielectric Strength: >10 Kv/Mm
  • Use Temp: -40+200 Degree
  • Specification: UL, SGS
Product Description
Thermal paste heatsink gap filling silicone paste for LED

Features:
1.Super soft: <10 degrees,
2.High thermal conductivity,
3.High and low temperature resistance
4. Without curing, convenient operation, high efficiency,
5.Excellent insulating performance, aging resistance, long storage life,
 
Application:
1.Converter and rectifier;
2.Energy conversion device;
3.Integrated circuit, CPU memory module;
4.Electronic and electrical heating spare parts.
5.LED lamp, power supply, UPS power supply etc.;
6.power semiconductor, fever transistor and MOSFET ;
7.Monitor, communication equipments and other consumer electronic products;

 
This series product is organic silicone as the main raw material, add heat resistance and excellent heat conduction performance materials as thermal conductive filler, made into thermal conductive filling gap glue  .
The series is a pre cured colloid, don't need to prevent curing after assembly, save time, improve production efficiency .




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