Gold Member Since 2015
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Shenzhen City Jia Rifeng Tai Electronic Technology Co., Ltd.

Silicone Gap Pad, Soft Gap Pad, Thermal Conductive Silicone manufacturer / supplier in China, offering 1.5W/M. K Cooling Thermal Conductive Heatsink Silicone Soft Gap Pad, High Voltage Insulation Heat Disspation Rubber Silicone Cloth, Ys-3172 Shore Platinum Extrusion Silicone Raw Material and so on.

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Supplier Homepage Product Thermal Silicone Series Thermal Silicone Sheet 1.5W/M. K Cooling Thermal Conductive Heatsink Silicone Soft Gap Pad

1.5W/M. K Cooling Thermal Conductive Heatsink Silicone Soft Gap Pad

FOB Price: Get Latest Price
Min. Order: 100 Pieces
Payment Terms: L/C, T/T, Paypal, Money Gram, Western Union

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Basic Info
  • Model NO.: PM150
  • Type: Insulation Sheet
  • Material: Rubber
  • Maximum Voltage: <10KV
  • Certification: UL, SGS
  • Thickness Tolerance(Mm): 0.12+-0.01
  • Specific Gravity: 2.05
  • Thermal Conductivity(W/M-K): 1.5
  • Application: Electronic Products
  • Chemistry: Organic Insulation
  • Thermal Rating: 200 200
  • Classification: Organic Insulating Material
  • Color: Grey
  • Thickness(Mm): 0.25--15
  • Hardness(Shore a): 30+-5
Product Description
Product Introduction

JRF-PM150 has excellent thermal conductivity and electrical insulation performance. Not only can satisfy the majority of electronic product thermal insulation requirements, but also widely used in the thermal requirements that are not too high in electronic products. With the heat conduction performance, stable and the product also has the viscosity, easy to use.

JRF-PM150 by using the heat conduction, soft silicone heat-conducting material stable insulation performance characteristics and soft and elastic, good contact is arranged between the heating device and the heat radiating member, which achieve heat transfer and insulation effect.


Applications:
1.LED lighting, lighting equipment
2.Household appliances, LCD display
3.Semiconductor and the radiating fin between
4.Communication product, intelligent mobile phone, tablet computer
5.Desktop computer, notebook and other portable computer
6.Large power supply etc. 


Performance and characteristics:
1.High thermal conductivity, heat transfer coefficient 1.5W/m-k
2.Stable performance, low thermal resistance, effectively improve the heat     transfer rate
3.Low hardness, its viscosity, easy to use and high degree of bonding
4.By UL and V-O certification standards


Specification:
Standard size 200mm*400mm , 310mm*310mm according to customer needs cutting type.

Basic thickness 0.25mm*15mm thickness, special thickness size can be customized

Itself slightly viscous, if need to strengthen the adhesive can be according to customer's requirement



Product color is mass produce color , special color you need, we can adjust according to the actual situation .

1.5W/M. K Cooling Thermal Conductive Heatsink Silicone Soft Gap Pad

1.5W/M. K Cooling Thermal Conductive Heatsink Silicone Soft Gap Pad
1.5W/M. K Cooling Thermal Conductive Heatsink Silicone Soft Gap Pad
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