Black Epoxy Potting Glue / Potting Compound for Electronic Components
|FOB Unit Price:||US $3.68 US $2.86|
|Purchase Qty. (Pieces)||FOB Unit Price|
|Production Capacity:||100, 000|
|Payment Terms:||L/C, T/T, Western Union, Paypal, Money Gram|
- Model NO.: BM800
- Morphology: Liquid
- Material: Silicone
- Main Agent Composition: Rubber
- Promoter Composition: Filler
- Color: Black
- Curing Time(25c): 480min
- Flame Rating: 94-V0
- Operable Time: ≤60min
- Dielectric Strength: ≥27kv/mm
- Trademark: JRFT
- Specification: Customize
- HS Code: 682476
- Bonding Function: High Temperature Resistant Adhesive
- Application: Automobile
- Classification: Encapsulant
- Characteristic: Waterproof
- Composition: Organic Material
- Viscosity: 1980cps
- Thermal Conductivity: 1.5W/M.K
- Mixure Ratio: 10:1
- Hardness: 50--60 Shorea
- Certifications: SGS/UL/ISO9001/RoHS
- Transport Package: Carton
- Origin: China
Two Component Silicone Sealant Features
1. Operation time: operation time within 240 minutes at room temperature
2. Easy to operate
3. Bonding material widely: can be applied to PC, ABS, PP, PVC, etc., other materials and the surface of metal
4. With excellent electrical properties: excellent insulating performance, thermal conductivity, heat dissipation, anti-shock, corona resistance,
5. Temperature Resistant Performance: high and low temperature resistance, good aging resistance.
6. Flexible Glue Film: no shrikage during curing, excellent toughness of the elastomer is formed after curing, absorb vibration and shock, good impact resistance, good cushioning effect, for electronics, eletrical appliances, glass and other fragile products, to provide excellent resistance to shocks and reliability.
7. Strong Weather Resistance: anti-ultraviolet radiation, aging resistance, anti-ozone, moisture proof, waterproof, resist to salt atmosphere, mold, etc., can work in the harsh natural environmental.
1. LED light/driver
2. Power switch
3. Electronic component
4. Electronic circuit, etc.
1. High thermal conductivity: provides the highest thermal conductivity with its viscosity range in the world.
2. Low stress: exhibits low shrinkage and stress on components as it is curing; low thermal expansion after curing
3. Highly reliable: composed of an addition-curing polydimethly siloxane polymer that will not deploymerize when heated in confined spaces
4. Low viscosity: maintains low viscosity for ease of component encapsulation compared to other highly thermal conductive materials
5. Environmentally Resistant: Provides excellent thermal shock resistance
6. UL-rated: meets requirements of UL 94 V-0 standard, provides excellent flame retardancy.
Thermal Silicone Encapsulants
The thermal conductive encapsulants add molding organic silicone sealant, use imported organic silicone as the main material, select the polymer materials as fillers, manufactured elaborately electronic potting glue. The viscosity of the glue can be divided into into high, middle, low three type, color also can be optional according to customers' demand and has heating conducting, flame retardant, bonding, sealing, waterproof, potting and encapsulation properties.
|Properties Parameter Table|
|B Group||3000||White||A Group||1000~2000||White/Black|
|A Group||1520||Black/Grey/White||B Group||1000~2500||Transparency|
|Operating Performance||Test Item||Unit||Numerical Value||Numerical Value||Test Method|
|After Mixture Viscosity||cps||1980||2000||T1794|
|Operable Time||Min 25ºC||≤60||≤80||TM650|
|Curing Time||Min 25ºC||480||500||TM650|
|Curing Time||Min 80ºC||30||40||TM650|
|After Curing||Hardness||ShoreA||50~60||50~60||ASTM D2240|
|Thermal Conductivity||W/m.k||0.8||0.6||ASTM D5470|
|Dielectric Strength||KV/mm||≥27||≥15||ASTM D149|
|Dielectric Constant||1.2MHz||3.0~3.3||3||GB/T 12636|
|Volume Resistivity||Ω.cm||≥1.0*10∧18||≥1.0*10∧14||ASTM D257|
|Flame Rating||--||94 V-O||94 V-0||ULNo.: E341634|
1. In time delivery
2. Quality assurance
3. Competitive price
4. Free samples are available
5. Customized order is available
6. Professional recommendations on products choice
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