Gold Member Since 2015
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Shenzhen City Jia Rifeng Tai Electronic Technology Co., Ltd.

Aluminium Nitride, Aln, Aluminium Nitride Ceramic Substrate manufacturer / supplier in China, offering High Thermal Conductivity Aluminium Nitride / Aln / Ceramic Substrate, 0.8mm Thickness Fireproof Insulatior Silicone Cloth Sheet for Electronic Equipment, Heat Dissipation Insulation Silicone Sloth for Heatsink and The Heat Disffusion Film and so on.

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Supplier Homepage Product Thermal Ceramic Series ALN Ceramic High Thermal Conductivity Aluminium Nitride / Aln / Ceramic Substrate

High Thermal Conductivity Aluminium Nitride / Aln / Ceramic Substrate

Purchase Qty.:
10-99 100-999 1,000+
FOB Unit Price: US $0.12 US $0.09 US $0.07
Purchase Qty. (Pieces) FOB Unit Price
10-99 US $0.12
100-999 US $0.09
1,000+ US $0.07
Get Latest Price
Port: Shenzhen, China
Production Capacity: 100, 000
Payment Terms: L/C, T/T, Western Union, Paypal, Money Gram

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Basic Info
  • Model NO.: TC-026
  • Application: Electronics
  • Material: Aluminum
  • Corrosion Rate: 0.01-0.1
  • Thermal Conductivity: 160-190W/M-K
  • Maximum Voltage: <10kv
  • Shiping Way: DHL/Aramex/UPS/TNT
  • Condition: 100% Original New
  • Transport Package: Carton
  • Origin: China
  • Customized: Customized
  • Certification: ISO, CE, SGS UL
  • Feature: High Temperature
  • Type: Electrothermal Ceramics
  • Lead Time: 1-3 Working Days
  • Color: Grey
  • Density: 3.3G/Cm3
  • Trademark: JRFT
  • Specification: Customize
  • HS Code: 8547100000
Product Description
High Thermal Conductivity Aluminium Nitride / ALN / Ceramic Substrate

1.High hardness , diversity                                 2. High precision and density
3.High reliability and stability                               4. High thermal conductivity
5.Extremely abrasive resistance performance                6. Wide scope of application

high-power circuits, RF and microwave circuits , GaAs crystal crucible, Al evaporation pan, MHD power generation equipment

Material Properties of Aluminum Nitride Substrate/Wafer
Property ContentProperty Index
Resistance to Thermal ShockNo Cracks
Thermal conductivity(30°C, W/m.k)≥170
Linear expansion coefficient
(/°C, 5°C/min, 20-300°C)
Flexural strength (MPa)382.7
Volume Resistivity (Ω.cm)1.4×1014
Dielectric constant(1MHz)8.56
Chemical Durability (mg/cm2)0.97
Dielectric strength (KV/mm)18.45
Surface roughness Ra(μm)0.3~0.5
Camber (length‰)≤2‰
Appearance/ ColorDense/ Dark Gray

Product Introduction
Aluminum nitride ceramic substrate, high thermal conductivity, low coefficient of expansion, high strength, high temperature resistance, chemical resistance, high resistivity , low dielectric loss, is the ideal LSI heat dissipation board and packaging materials.
AIN ceramics use heat resistant melt erosion and thermal shock resistance, can produce GaAs crystal crucible, Al evaporation pan, MHD power generation equipment and high temperature turbine corrosion resistant parts, using its optical properties can be used as an infrared window.
Non-standard products , please contact us to provide drawings of your products.
welcome drawings processing customized zirconia /alumina / aluminum nitride . 

Contact Information : 

We can make many specifications according to your requests . 

Free samples are available , for more information , pls kindly let me . 

Mob : +86 18270827737


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