Gold Member Since 2015
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Shenzhen City Jia Rifeng Tai Electronic Technology Co., Ltd.

Solar Encapsulant, Silicone Solar Encapsulant, Two Component Solar Encapsulant manufacturer / supplier in China, offering High Quality Two Component High Thermal Conductive Solar Silicone Encapsulant, 0.8mm Thickness Fireproof Insulatior Silicone Cloth Sheet for Electronic Equipment, Heat Dissipation Insulation Silicone Sloth for Heatsink and The Heat Disffusion Film and so on.

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Supplier Homepage Product Silicone Encapsulant Series Thermal Encapsulant High Quality Two Component High Thermal Conductive Solar Silicone Encapsulant

High Quality Two Component High Thermal Conductive Solar Silicone Encapsulant

Purchase Qty.:
5-99 100-499 500+
FOB Unit Price: US $7.89 US $7.12 US $5.12
Purchase Qty. (kg) FOB Unit Price
5-99 US $7.89
100-499 US $7.12
500+ US $5.12
Get Latest Price
Port: Shenzhen, China
Production Capacity: 100000kg/Month
Payment Terms: L/C, T/T, Western Union, Paypal, Money Gram

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Basic Info
  • Model NO.: BM800
  • Morphology: Waterproof
  • Material: Silicone
  • Main Agent Composition: Silicone
  • Promoter Composition: Curing Agent
  • Color: Transparent
  • Viscosity: 1980cps
  • Curing Time(25c): 480min
  • Thermal Conductivity: 1.5W/M.K
  • Flame Rating: 94-V0
  • Sample: Existing Sample
  • Transport Package: Tin Packing
  • Origin: Shenzhen, Guangdong
  • Bonding Function: Structural Adhesive
  • Application: Solar Cells/LED Lighting
  • Classification: Room Curing
  • Characteristic: Waterproof
  • Composition: Organic Material
  • Mixure Ratio: 1:1
  • Operable Time: ≤60min
  • Hardness: 50--60 Shorea
  • Dielectric Strength: ≥27kv/mm
  • Certifications: SGS/UL/ISO9001/RoHS
  • Trademark: J
  • Specification: 10kg/25kg
  • HS Code: 3506919090
Product Description
Two Component Silicone Sealant Features
1. Operation time: operation time within 240 minutes at room temperature
2. Easy to operate
3. Bonding material widely: can be applied to PC, ABS, PP, PVC, etc., other materials and the surface of metal
4. With excellent electrical properties: excellent insulating performance, thermal conductivity, heat dissipation, anti-shock, corona resistance, 
5. Temperature Resistant Performance: high and low temperature resistance, good aging resistance.
6. Flexible Glue Film: no shrikage during curing, excellent toughness of the elastomer is formed after curing
7. Strong Weather Resistance: anti-ultraviolet radiation, aging resistance, anti-ozone, moisture proof, waterproof, resist to salt atmosphere, mold, etc., can work in the harsh natural environmental.

1. LED light/driver
2. Power switch
3. Electronic component
4. Electronic circuit, etc.

1. High thermal conductivity: provides the highest thermal conductivity with its viscosity range in the world.
2. Low stress: exhibits low shrinkage and stress on components as it is curing; low thermal expansion after curing
3. Highly reliable: composed of an addition-curing polydimethly siloxane polymer that will not deploymerize when heated in confined spaces
4. Low viscosity: maintains low viscosity for ease of component encapsulation compared to other highly thermal conductive materials
5. Environmentally Resistant: Provides excellent thermal shock resistance
6. UL-rated: meets requirements of UL 94 V-0 standard, provides excellent flame retardancy.

Thermal Silicone Encapsulants
The thermal conductive encapsulants add molding organic silicone sealant, use imported organic silicone as the main material, select the polymer materials as fillers, manufactured elaborately electronic potting glue. The viscosity of the glue can be divided into into high, middle, low three type, color also can be optional according to customers' demand and has heating conducting, flame retardant, bonding, sealing, waterproof, potting and encapsulation properties.

Physical Properties
Properties Parameter Table
Before CuringComponent(1:1)Viscosity(cps)ColorComponent(10:1)ViscosityColor
B Group3000WhiteA Group1000~2000White/Black
A Group1520Black/Grey/WhiteB Group1000~2500Transparency
Operating PerformanceTest ItemUnitNumerical ValueNumerical ValueTest Method
Mixture RatioKG1:110:1Metage
After Mixture Viscositycps19802000T1794
Operable TimeMin 25ºC≤60≤80TM650
Curing TimeMin 25ºC480500TM650
Curing TimeMin 80ºC3040TM650
After CuringHardnessShoreA50~6050~60ASTM D2240
Thermal ConductivityW/m.k0.80.6ASTM D5470
Dielectric StrengthKV/mm≥27≥15ASTM D149
Dielectric Constant1.2MHz3.0~3.33GB/T 12636
Volume ResistivityΩ.cm≥1.0*10∧18≥1.0*10∧14ASTM D257
Flame Rating--94 V-O94 V-0ULNo.: E341634

Our Services
1. In time delivery
2. Quality assurance
3. Competitive price
4. Free samples are available
5. Customized order is available
6. Professional recommendations on products choice

Why Choose Us?
1. Here you will find the most competitive factory price which is almost equal to the actual cost
2. We will make a strict time schedule for your order to 100% ensnures the timely delivery.
3. We can make the tape into the size or shapes as requested
4. You will be kept updated of the production state during the whole production process.
5. Over 5 years on the thermal silicone encapsulant manufacturing.
6. Prompt reply within 12 hours
7. Custom logo printing is accepted.

Contact Information
 +86 182-7082-8627
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